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  • 001 profile_image
    54.♡.244.132 TSMC plans A14 process manufacturing in Kaohsiung, say sources > ニュース
  • 002 profile_image
    52.♡.138.176 [사내소식] 2024년 리더십 특별 세미나 진행 > 공지사항
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    54.♡.59.155 消息 3 페이지
  • 004 profile_image
    23.♡.178.124 국내 파운드리 3사, MPW 대폭 확대...팹리스 키운다 > 새소식
  • 005 profile_image
    184.♡.239.35 [報道記事]セミソリューション、購買条件部協力事業優秀成功事例企業選定 > お知らせ
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    52.♡.13.143 TSMC capacity utilization fall to widen in 1H23 > 消息
  • 007 profile_image
    44.♡.89.189 Foundries may lower prices for mature processes in 2Q24 > 消息
  • 008 profile_image
    47.♡.51.54 [공지사항] 제21기 정기주주총회 소집통지의 건 > 공지사항
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    54.♡.12.115 [보도기사] 세미솔루션, 시스템반도체 핵심설계기술 미국특허권 획득 > 공지사항
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    52.♡.156.186 [報道記事]セミソリューション、システム半導体コア設計技術米国特許権を獲得 > お知らせ
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    18.♡.39.188 Memory prices continue to rise despite ending of seasonal demand > ニュース
  • 012 profile_image
    44.♡.69.106 UMC negotiates higher quotes for new contract with Samsung > 消息
  • 013 profile_image
    34.♡.138.57 ファラデー、すべてのファウンドリ向けのFinFET技術向け設計実装サービスを発表 > ニュース
  • 014 profile_image
    168.♡.28.65 [보도기사] 대기업-중소기업 맞손…수입 의존했던 디스플레이 부속품 R&D로 국산화 개발 성공 > 공지사항
  • 015 profile_image
    104.♡.169.78 SEMISOLUTION
  • 016 profile_image
    104.♡.60.115 SEMISOLUTION
  • 017 profile_image
    104.♡.173.252 공시자료 1 페이지
  • 018 profile_image
    34.♡.82.79 SEMISOLUTION
  • 019 profile_image
    168.♡.28.64 Global wafer foundry industry, 2026 and beyond > 새소식
  • 020 profile_image
    104.♡.169.76 ニュース 1 페이지
  • 021 profile_image
    104.♡.169.79 RFQ 1 페이지
  • 022 profile_image
    104.♡.60.113 Global wafer foundry industry, 2026 and beyond > News
  • 023 profile_image
    52.♡.218.25 Preparing For 5G Millimeter Wave And 6G > 새소식
  • 024 profile_image
    3.♡.170.186 Foundry capacity to stay tight in 2022 as global IC shortage lingers > ニュース
  • 025 profile_image
    3.♡.176.44 [공지] 제20기 정기주주총회 소집통지의 건 > 공지사항
  • 026 profile_image
    216.♡.66.242 전체검색 결과
  • 027 profile_image
    18.♡.58.238 Taiwan wafer foundry industry, 4Q 2025 > 消息
  • 028 profile_image
    44.♡.74.196 Foundry houses may see orders, capacity utilization rebound in 2H23 > ニュース
  • 029 profile_image
    47.♡.25.160 [공지] KAIST GCC(글로벌기술사업화센터) 글로벌 시장진출 프로그램 지원사업 선정 > 공지사항
  • 030 profile_image
    100.♡.133.214 TSMC may have to raise capex for 2022 > ニュース
  • 031 profile_image
    188.♡.102.134 【通知】2022年第二次海外标准认证获取支持企业评选 > 注意
  • 032 profile_image
    54.♡.62.248 [보도기사]세미솔루션, ‘2025년도 구매연계·상생협력R&D사업 유공자 포상’ 수상 > 공지사항
  • 033 profile_image
    98.♡.66.172 NAND flash shortage may occur in 2H24 > News
  • 034 profile_image
    3.♡.106.93 [专利注册] 专利技术注册-系统半导体模拟设计IP > 注意
  • 035 profile_image
    34.♡.95.99 Intel's EMIB becomes potential alternative to TSMC's CoWoS > ニュース
  • 036 profile_image
    100.♡.153.9 [Notice] KAIST GCC (Global Technology Commercialization Center) Global Market Entry Program Support Project Selection > Notice
  • 037 profile_image
    54.♡.32.123 [한국기업데이타] 기술역량우수기업인증서를 취득하였습니다. > 공지사항
  • 038 profile_image
    52.♡.62.139 China foundries enjoy robust demand from domestic market > 새소식
  • 039 profile_image
    207.♡.13.150 [공지사항] 기업은행 'IBK강소기업' 선정 > 공지사항
  • 040 profile_image
    54.♡.147.79 [공지] 해외특허기술등록의 건 – 시스템반도체 아날로그 설계 IP의 건 > 공지사항
  • 041 profile_image
    54.♡.7.119 OpenAI's Altman forges AI alliances with Samsung and SK Hynix in South Korea > 새소식
  • 042 profile_image
    47.♡.117.184 TSMC to fab Nvidia next-gen AI chip, sources say > News
  • 043 profile_image
    34.♡.82.75 MediaTek intros flagship 4nm smartphone SoC > 消息
  • 044 profile_image
    34.♡.156.153 Samsung reportedly wins first 2nm order in the most advanced chip-making race > ニュース
  • 045 profile_image
    44.♡.213.220 UMC reportedly mulling 6% quote hikes for 22/28nm chips in 2023 > ニュース
  • 046 profile_image
    3.♡.148.166 [보도기사] 대기업-중소기업 맞손…수입 의존했던 디스플레이 부속품 R&D로 국산화 개발 성공 > 공지사항
  • 047 profile_image
    18.♡.12.157 Foundry customers reluctant to accept further price increases > ニュース
  • 048 profile_image
    54.♡.126.132 News 7 페이지
  • 049 profile_image
    23.♡.179.27 TSMC to raise quotes for 5nm, 3nm process manufacturing in 2025 > News
  • 050 profile_image
    54.♡.169.168 자주하시는 질문
  • 051 profile_image
    18.♡.124.6 Faraday, Intel 18A 기술을 기반으로 Arm 기반 64코어 SoC 개발 계획 발표 > 새소식
  • 052 profile_image
    190.♡.249.241 [공지] 2022년2차 해외규격인증획득지원사업자 선정 > 공지사항
  • 053 profile_image
    47.♡.47.181 전체검색 결과
  • 054 profile_image
    34.♡.9.144 TSMC turns active in seeking more long-term contracts > 消息
  • 055 profile_image
    98.♡.40.168 Foundry capacity expansion projects may face delays > ニュース
  • 056 profile_image
    52.♡.229.124 Three domestic foundries significantly expand MPW... grow fabless > 消息
  • 057 profile_image
    100.♡.155.89 Taiwan wafer foundry industry, 3Q 2025 > 消息
  • 058 profile_image
    3.♡.213.161 ファラデー、Intel 18AテクノロジーでArmベースの64コアSoCを開発する計画を発表 > ニュース
  • 059 profile_image
    18.♡.11.93 消息 2 페이지
  • 060 profile_image
    34.♡.45.47 【通知】完成联合投资式购买有条件新产品开发项目“优秀”项目评价 > 注意
  • 061 profile_image
    43.♡.1.69 [보도기사]세미솔루션, ‘2025년도 구매연계·상생협력R&D사업 유공자 포상’ 수상 > 공지사항
  • 062 profile_image
    193.♡.203.6 Taiwan foundries may be haunted by power shortage > ニュース
  • 063 profile_image
    52.♡.77.169 UMC likely to enjoy 2-3 year advantage over TSMC in fulfilling auto IC orders > News
  • 064 profile_image
    184.♡.95.195 Foundries remain aggressive in fab capacity expansions > 새소식
  • 065 profile_image
    54.♡.125.129 ファラデー、サムスンファウンドリ14LPPプロセスにSAFE™IPポートフォリオを提供 > ニュース
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    23.♡.225.190 TSMC to fab Nvidia next-gen AI chip, sources say > ニュース
  • 067 profile_image
    18.♡.138.148 ファラデーFPGA-Go-ASIC™、市場進出に成功 > ニュース
  • 068 profile_image
    23.♡.99.55 [포럼행사] 공공인프라 시스템 반도체 활성화 방안 포럼 초청 > 공지사항
  • 069 profile_image
    47.♡.26.223 Semisolution Ltd., selected for 2021 GMS (GBC overseas marketing) support project > Notice
  • 070 profile_image
    52.♡.203.206 [投资协议]Bonanza-新韩GIB创新半导体投资协会投资协议仪式论文集 > 注意
  • 071 profile_image
    18.♡.137.234 TSMC gearing up for 3nm capacity expansion, 2nm fab construction > ニュース
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    34.♡.82.67 CES 2024: Sony, Panasonic, and Sharp introduce cutting-edge AI applications in autos, homes > 消息
  • 073 profile_image
    34.♡.150.196 Intel's EMIB becomes potential alternative to TSMC's CoWoS > News
  • 074 profile_image
    52.♡.87.224 美国各州投资企业奖励动向 > 参考室
  • 075 profile_image
    169.♡.36.82 Pure-play foundries poised to enjoy profit growth in 2022 > ニュース
  • 076 profile_image
    3.♡.103.254 Automotive IC supply remains tight > 새소식
  • 077 profile_image
    3.♡.205.90 TSMC discloses plan for 2nd fab in Japan > ニュース
  • 078 profile_image
    47.♡.122.68 [보도기사] (주)세미솔루션, 캐나다 AI반도체 기업 Blumind社와 사업제휴계약 체결 > 공지사항
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    3.♡.253.213 자료실 1 페이지
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    3.♡.106.226 Samsung's ups and downs (4): The manufacturing capability of Samsung's foundry biz > 消息
  • 081 profile_image
    34.♡.243.131 Semisolution Co., Ltd.入选2021年GMS（GBC海外营销）支援项目 > 注意
  • 082 profile_image
    23.♡.179.120 TSMC, UMC to see 22/28nm chips capacity fully loaded till end-year > News
  • 083 profile_image
    181.♡.182.159 TSMC, Samsung face difficulty in ramping up 3nm chip production > 消息
  • 084 profile_image
    52.♡.105.244 [公告] 关于发行新股的公告 > 注意
  • 085 profile_image
    44.♡.235.20 [보도기사] ㈜세미솔루션, 한국기업데이터 기술신용평가 ‘기술역량 우수기업’ 인증서 획득 > 공지사항
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    34.♡.82.77 CES 2024: Sony, Panasonic, and Sharp introduce cutting-edge AI applications in autos, homes > 消息
  • 087 profile_image
    157.♡.39.12 Global wafer foundry industry, 2026 and beyond > 消息
  • 088 profile_image
    18.♡.91.101 SMIC warns of 2026 memory squeeze: AI demand surges, customers turn cautious > 消息
  • 089 profile_image
    18.♡.36.1 Taiwan wafer foundry industry, 4Q 2025 > News
  • 090 profile_image
    3.♡.85.234 Testing houses to see strong 1Q22 > 새소식
  • 091 profile_image
    107.♡.208.39 [Press article] Semisolution Co., Ltd. signs a business partnership agreement with Blumind, a leading Canadian AI semiconductor company > Notice
  • 092 profile_image
    47.♡.114.194 TSMC, Samsung face difficulty in ramping up 3nm chip production > ニュース
  • 093 profile_image
    189.♡.197.202 [お知らせ]第19期定時株主総会招集通知の件 > お知らせ
  • 094 profile_image
    3.♡.98.99 Faraday Delivers DDR/LPDDR Combo PHY IP Solutions on UMC's 22ULP and 14FFC > News
  • 095 profile_image
    207.♡.13.31 [보도기사]세미솔루션, ‘2025년도 구매연계·상생협력R&D사업 유공자 포상’ 수상 > 공지사항
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    40.♡.167.70 [한국기업데이타] 기술역량우수기업인증서를 취득하였습니다. > 공지사항
  • 097 profile_image
    3.♡.146.193 [報道記事](株)セミソリューション、カナダ代表AI半導体企業Blumind社と事業提携契約締結 > お知らせ
  • 098 profile_image
    44.♡.105.234 [业务协议]半解决方案-Bonanza PE投资业务协议 > 注意
  • 099 profile_image
    40.♡.167.33 [공지사항] 기업은행 'IBK강소기업' 선정 > 공지사항
  • 100 profile_image
    43.♡.7.191 SEMISOLUTION
  • 101 profile_image
    34.♡.2.57 Three domestic foundries significantly expand MPW... grow fabless > ニュース
  • 102 profile_image
    34.♡.41.241 Taiwan wafer foundry industry, 1Q 2025 > 새소식
  • 103 profile_image
    157.♡.39.203 [보도기사]세미솔루션, ‘2025년도 구매연계·상생협력R&D사업 유공자 포상’ 수상 > 공지사항
  • 104 profile_image
    52.♡.144.184 전체검색 결과
  • 105 profile_image
    3.♡.174.110 消息 11 페이지
  • 106 profile_image
    191.♡.26.105 [認証通知]小部長専門企業認証書取得 > お知らせ
  • 107 profile_image
    207.♡.13.127 [사내소식] 2024년 리더십 특별 세미나 진행 > 공지사항
  • 108 profile_image
    98.♡.131.195 Taiwan wafer foundry industry, 3Q 2025 > News
  • 109 profile_image
    47.♡.34.235 TSMC to soon announce 2nd fab project in Japan, say sources > ニュース
  • 110 profile_image
    44.♡.202.136 Taiwan wafer foundry industry, 3Q 2025 > News
  • 111 profile_image
    44.♡.116.149 [報道記事]セミソリューション、システム半導体コア設計技術米国特許権を獲得 > お知らせ
  • 112 profile_image
    34.♡.88.37 Foundries may lower prices for mature processes in 2Q24 > 새소식
  • 113 profile_image
    34.♡.82.78 TSMC lowers 2024 semiconductor, foundry outlook > 消息
  • 114 profile_image
    40.♡.167.48 전자증권 전환대상 주권 등의 권리자 보호 안내 > 공지사항
  • 115 profile_image
    44.♡.232.231 ファラデーFPGA-Go-ASIC™、市場進出に成功 > ニュース
  • 116 profile_image
    3.♡.180.70 IC design houses uncertain about demand in 2023 > 消息
  • 117 profile_image
    40.♡.167.132 [특허등록] 특허기술등록의 건 - 시스템반도체 아날로그설계 IP의 건 > 공지사항
  • 118 profile_image
    18.♡.240.226 [新闻文章] Semisolution 在“SEDEX 2023”上推出按需系统半导体技术和解决方案 > 注意
  • 119 profile_image
    52.♡.144.217 새소식 5 페이지
  • 120 profile_image
    44.♡.65.8 Samsung reportedly wins first 2nm order in the most advanced chip-making race > ニュース
  • 121 profile_image
    34.♡.82.74 [通知]关于召开第十九次股东大会的通知 > 注意
  • 122 profile_image
    23.♡.103.31 UMC’s 22nm fab; more fabs; flexible chips; Russia sanctions. > ニュース
  • 123 profile_image
    34.♡.125.239 News 10 페이지
  • 124 profile_image
    207.♡.13.116 [투자협약] 보난자-신한GIB 혁신반도체 투자조합 투자 협약식 진행의 건 > 공지사항
  • 125 profile_image
    216.♡.216.106 공지사항 50 페이지
  • 126 profile_image
    151.♡.147.26 공지사항 2 페이지
  • 127 profile_image
    47.♡.112.243 TSMC overseas foundry quotes to be 10-30% higher than in Taiwan > ニュース
  • 128 profile_image
    52.♡.123.241 [報道記事](株)セミソリューション、カナダ代表AI半導体企業Blumind社と事業提携契約締結 > お知らせ
  • 129 profile_image
    52.♡.144.213 [보도기사] 세미솔루션, '반도체대전(SEDEX 2023)'서 주문형시스템반도체 기술 · 솔루션 공개 > 공지사항
  • 130 profile_image
    98.♡.107.102 Intel-UMC to boost Intel market share via advanced foundry services for UMC customer base > 새소식
  • 131 profile_image
    54.♡.55.147 [Press article] Semisolution Co., Ltd. expands application-specific semiconductor (ASIC) development services to the automotive semiconductor field > Notice
  • 132 profile_image
    54.♡.104.83 SEMISOLUTION
  • 133 profile_image
    52.♡.113.104 [お知らせ]第19期定時株主総会招集通知の件 > お知らせ
  • 134 profile_image
    207.♡.13.51 [보도기사] 대기업-중소기업 맞손…수입 의존했던 디스플레이 부속품 R&D로 국산화 개발 성공 > 공지사항
  • 135 profile_image
    44.♡.120.22 [Exhibition participation] Participation in the 23rd Semiconductor Industry Exhibition SEDEX 2021 (2021.10.27~29) > Notice
  • 136 profile_image
    34.♡.82.69 [Press article] Semisolution unveils on-demand system semiconductor technology and solution at ‘SEDEX 2023’ > Notice
  • 137 profile_image
    34.♡.132.215 TSMC to raise foundry prices by 5-10% across advanced nodes in 2026 > ニュース
  • 138 profile_image
    52.♡.144.218 Faraday, AI 기반 차량용 주문형반도체 혁신 위해 Arm과 협력 > 새소식
  • 139 profile_image
    47.♡.43.90 Highlights of the day: Foundry quotes continue rising > ニュース
  • 140 profile_image
    44.♡.172.204 Faraday Announces Multi-site Manufacturing Support in ASIC > ニュース
  • 141 profile_image
    98.♡.60.17 CES 2024: Sony, Panasonic, and Sharp introduce cutting-edge AI applications in autos, homes > 새소식
  • 142 profile_image
    44.♡.6.93 [Certificate Notice] Acquisition of Certificate of Professional Manager > Notice
  • 143 profile_image
    52.♡.209.13 Global wafer foundry industry, 2026 and beyond > ニュース
  • 144 profile_image
    73.♡.159.208 [전시회참가] 제23회 반도체 산업 대전 SEDEX 2021 전시회 참가의 건 (2021.1027~29) > 공지사항
  • 145 profile_image
    23.♡.148.226 [新闻文章] Semisolution获得系统半导体核心设计技术美国专利 > 注意
  • 146 profile_image
    34.♡.45.183 Why Wafer Bumps Are Suddenly So Important > 새소식
  • 147 profile_image
    52.♡.194.165 MediaTek intros flagship 4nm smartphone SoC > ニュース
  • 148 profile_image
    35.♡.117.160 Global wafer foundry industry, 2026 and beyond > ニュース
  • 149 profile_image
    34.♡.114.170 [Sogang University Industry-University Cooperation Foundation] ICT Research Center Support Project Joint Research Agreement Signed > Notice
  • 150 profile_image
    35.♡.253.85 TSMC, Samsung face difficulty in ramping up 3nm chip production > 새소식
  • 151 profile_image
    52.♡.33.248 TSMC to raise foundry prices by 5-10% across advanced nodes in 2026 > ニュース
  • 152 profile_image
    47.♡.21.90 TSMC reiterates 30% growth goal for 2022, citing surging demand from auto, HPC sectors > ニュース
  • 153 profile_image
    54.♡.152.179 【新闻报道】Semisolution Co., Ltd.与加拿大领先的AI半导体公司Blumind签署业务合作协议 > 注意
  • 154 profile_image
    100.♡.34.97 Faraday, UMC의 28HPC+ 프로세스에서 향상된 기가비트 이더넷 PHY 공개 > 새소식
  • 155 profile_image
    52.♡.58.41 Preparing For 5G Millimeter Wave And 6G > ニュース
  • 156 profile_image
    168.♡.28.67 회사소개
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