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  • 001 profile_image
    216.♡.216.114 UMC may resume 14/12nm nodes for new-gen car, networking chips > 消息
  • 002 profile_image
    61.♡.93.210 TSMC to enter 2nm, A14 process generations on schedule > 消息
  • 003 profile_image
    202.♡.167.40 [公告]海外专利技术注册-系统半导体模拟设计IP > 注意
  • 004 profile_image
    52.♡.144.211 [보도기사] 세미솔루션, 구매조건부 협력사업 우수성공사례기업 선정 > 공지사항
  • 005 profile_image
    52.♡.144.229 [공지사항] 제22기 정기주주총회 소집통지의 건 > 공지사항
  • 006 profile_image
    34.♡.82.79 [新闻文章] Semisolution 在“SEDEX 2023”上推出按需系统半导体技术和解决方案 > 注意
  • 007 profile_image
    52.♡.144.183 [공지사항] 2024년 2차 윈윈아너스 기념패 수여의 건 > 공지사항
  • 008 profile_image
    146.♡.186.88 [공지사항] 제22기 정기주주총회 소집통지의 건 > 공지사항
  • 009 profile_image
    34.♡.82.65 [사내소식] (주)세미솔루션 기부 동참(후원처: 비영리재단 한국저신장장애인연합회) > 공지사항
  • 010 profile_image
    124.♡.177.207 SEMISOLUTION
  • 011 profile_image
    47.♡.115.88 [Notice] 2022 2nd overseas standard certification acquisition support business selection > Notice
  • 012 profile_image
    52.♡.144.171 [公司新闻] Semisolution Co., Ltd. 捐赠（赞助商：Serving Friends International） > 注意
  • 013 profile_image
    34.♡.82.75 8-inch fabs to enjoy robust business growth through 2026, says VIS chair > 消息
  • 014 profile_image
    34.♡.82.78 [공지] 2022년2차 해외규격인증획득지원사업자 선정 > 공지사항
  • 015 profile_image
    44.♡.19.8 이미지 크게보기
  • 016 profile_image
    34.♡.28.78 [동향브리프_2023] 아시아-태평양지역 주변 주요국의 비지니스 과제와 재편동향 > 자료실
  • 017 profile_image
    54.♡.98.148 Samsung foundry business overview > 消息
  • 018 profile_image
    3.♡.34.98 오류안내 페이지
  • 019 profile_image
    34.♡.82.71 [사내소식] 2023년 법정의무교육 실시 > 공지사항
  • 020 profile_image
    47.♡.113.221 오류안내 페이지
  • 021 profile_image
    184.♡.239.35 米国州別投資企業のインセンティブの動向 > アーカイブ
  • 022 profile_image
    98.♡.39.241 UMC sees no signs of substantial demand recovery in 2H23 > ニュース
  • 023 profile_image
    100.♡.44.58 TSMC may have to raise capex for 2022 > 새소식
  • 024 profile_image
    146.♡.167.142 (주)세미솔루션, 2021 GMS (GBC 해외마케팅) 지원사업 선정 > 공지사항
  • 025 profile_image
    54.♡.185.255 TSMC sees 5/4nm capacity utilization pick up > ニュース
  • 026 profile_image
    107.♡.181.148 Foundries step up capacity expansions > News
  • 027 profile_image
    18.♡.58.238 TSMC capacity utilization fall to widen in 1H23 > 消息
  • 028 profile_image
    52.♡.144.138 TSMC plans price hike for 8-inch foundry services > 消息
  • 029 profile_image
    52.♡.142.199 Samsung's ups and downs (4): The manufacturing capability of Samsung's foundry biz > 消息
  • 030 profile_image
    34.♡.87.80 [공지사항] 기업은행 'IBK강소기업' 선정 > 공지사항
  • 031 profile_image
    3.♡.176.44 TSMC reiterates 30% growth goal for 2022, citing surging demand from auto, HPC sectors > News
  • 032 profile_image
    3.♡.253.174 자동차 신뢰성과 안전필수시스템 ISO26262의 이해 > 자료실
  • 033 profile_image
    54.♡.62.163 [공지사항] 기업은행 'IBK강소기업' 선정 > 공지사항
  • 034 profile_image
    54.♡.98.248 [공지] 제20기 정기주주총회 소집통지의 건 > 공지사항
  • 035 profile_image
    18.♡.11.93 TSMC cuts capex outlook after record 3Q22 profit > ニュース
  • 036 profile_image
    3.♡.148.166 TSMC may have to raise capex for 2022 > ニュース
  • 037 profile_image
    54.♡.122.193 IC design houses uncertain about demand in 2023 > 消息
  • 038 profile_image
    18.♡.137.234 TSMC, Samsung face difficulty in ramping up 3nm chip production > 새소식
  • 039 profile_image
    44.♡.139.149 TSMC maintains high capacity utilization for 7nm process platform > 消息
  • 040 profile_image
    18.♡.27.222 [기고] 시스템 반도체 산업 발전을 위한 정책 제안 > 새소식
  • 041 profile_image
    50.♡.72.185 China foundries enjoy robust demand from domestic market > ニュース
  • 042 profile_image
    52.♡.152.231 Foundries see IC design houses scale back orders for 4Q22 > News
  • 043 profile_image
    52.♡.144.196 [公司新闻] Semisolution Co., Ltd. 捐赠（赞助商：Serving Friends International） > 注意
  • 044 profile_image
    34.♡.252.22 Automotive IC market share to reach 10% by 2026 > News
  • 045 profile_image
    3.♡.85.234 TSMC maintains high capacity utilization for 7nm process platform > News
  • 046 profile_image
    3.♡.39.98 TSMC plans price hike for 8-inch foundry services > 새소식
  • 047 profile_image
    3.♡.171.106 UMC likely to enjoy 2-3 year advantage over TSMC in fulfilling auto IC orders > ニュース
  • 048 profile_image
    52.♡.104.214 Foundries remain aggressive in fab capacity expansions > ニュース
  • 049 profile_image
    54.♡.185.200 TSMC sees 5/4nm capacity utilization pick up > 새소식
  • 050 profile_image
    18.♡.79.144 [展示会参加] 第23回半導体産業大戦 SEDEX 2021 展示会参加の件 (2021.1027～29) > お知らせ
  • 051 profile_image
    23.♡.213.182 [投資協約]ボナンジャ - 新韓GIBイノベーション半導体投資組合投資協約式の進行の件 > お知らせ
  • 052 profile_image
    34.♡.114.170 [공지] KAIST GCC(글로벌기술사업화센터) 글로벌 시장진출 프로그램 지원사업 선정 > 공지사항
  • 053 profile_image
    3.♡.193.38 智原推出DDR/LPDDR通用物理层IP解决方案 适用于联电22ULP与14FFC工艺 > 消息
  • 054 profile_image
    44.♡.180.155 TSMC on track to move 2nm process to risk production in 4Q24 > 새소식
  • 055 profile_image
    44.♡.213.220 Foundries may lower prices for mature processes in 2Q24 > 새소식
  • 056 profile_image
    146.♡.183.215 TSMC on track to move 2nm process to risk production in 4Q24 > News
  • 057 profile_image
    98.♡.184.80 TSMC lowers 2024 semiconductor, foundry outlook > 消息
  • 058 profile_image
    3.♡.40.182 Faraday 宣布为所有代工厂提供 FinFET 技术设计实施服务 > 消息
  • 059 profile_image
    35.♡.86.200 Samsung, TSMC to win... “3-nano chips with GAA applied, mass-produced in the first half of next year” > 消息
  • 060 profile_image
    44.♡.232.55 Why Wafer Bumps Are Suddenly So Important > ニュース
  • 061 profile_image
    146.♡.161.216 [공지사항] 제21기 정기주주총회 소집통지의 건 > 공지사항
  • 062 profile_image
    47.♡.20.208 TSMC to raise foundry prices by 5-10% across advanced nodes in 2026 > 새소식
  • 063 profile_image
    34.♡.243.131 OpenAI's trillion-dollar chip plan can end well if right move is made > News
  • 064 profile_image
    47.♡.42.134 오류안내 페이지
  • 065 profile_image
    52.♡.63.151 Foundry customers reluctant to accept further price increases > ニュース
  • 066 profile_image
    184.♡.68.20 Specialty IC foundry VIS considering 12-inch fab > News
  • 067 profile_image
    3.♡.157.25 TSMC plans A14 process manufacturing in Kaohsiung, say sources > 새소식
  • 068 profile_image
    52.♡.92.83 [投資協約]ボナンジャ - 新韓GIBイノベーション半導体投資組合投資協約式の進行の件 > お知らせ
  • 069 profile_image
    34.♡.82.70 UMC negotiates higher quotes for new contract with Samsung > 消息
  • 070 profile_image
    3.♡.69.161 Why Wafer Bumps Are Suddenly So Important > News
  • 071 profile_image
    3.♡.29.96 TSMC discloses plan for 2nd fab in Japan > ニュース
  • 072 profile_image
    34.♡.163.103 Samsung foundry business overview > 새소식
  • 073 profile_image
    54.♡.109.140 [사내소식] 2024년 리더십 특별 세미나 진행 > 공지사항
  • 074 profile_image
    184.♡.167.217 전자증권 전환대상 주권 등의 권리자 보호 안내 > 공지사항
  • 075 profile_image
    3.♡.134.5 TSMC plans price hike for 8-inch foundry services > 새소식
  • 076 profile_image
    52.♡.157.90 전자증권 전환대상 주권 등의 권리자 보호 안내 > 공지사항
  • 077 profile_image
    54.♡.90.224 [인증공지] 소부장전문기업인증서 취득 > 공지사항
  • 078 profile_image
    34.♡.197.197 Faraday Delivers SAFE™ IP Portfolio for Samsung Foundry 14LPP Process > News
  • 079 profile_image
    3.♡.104.67 Taiwan wafer foundry industry, 3Q 2025 > News
  • 080 profile_image
    40.♡.167.150 [공지사항] 제21기 정기주주총회 소집통지의 건 > 공지사항
  • 081 profile_image
    44.♡.187.99 Taiwan wafer foundry industry, 3Q 2025 > 새소식
  • 082 profile_image
    34.♡.82.72 이미지 크게보기
  • 083 profile_image
    18.♡.158.19 TSMC on track to move 2nm process to risk production in 4Q24 > News
  • 084 profile_image
    35.♡.141.42 TSMC to expand 7nm and 28nm fab capacities > ニュース
  • 085 profile_image
    52.♡.46.142 [보도기사] 세미솔루션, '반도체대전(SEDEX 2023)'서 주문형시스템반도체 기술 · 솔루션 공개 > 공지사항
  • 086 profile_image
    54.♡.12.115 [Notice] Notice of convocation of the 19th regular general meeting of shareholders > Notice
  • 087 profile_image
    52.♡.209.13 TSMC may see revenue fall 10-15%, 7nm capacity utilization slip to 50% in 1Q23 > ニュース
  • 088 profile_image
    52.♡.218.219 Faraday Delivers DDR/LPDDR Combo PHY IP Solutions on UMC's 22ULP and 14FFC > News
  • 089 profile_image
    54.♡.7.119 [公告] 关于发行新股的公告 > 注意
  • 090 profile_image
    146.♡.188.228 전자증권 전환대상 주권 등의 권리자 보호 안내 > 공지사항
  • 091 profile_image
    35.♡.125.172 Samsung reportedly wins first 2nm order in the most advanced chip-making race > 消息
  • 092 profile_image
    34.♡.82.64 [공지사항] 기업은행 'IBK강소기업' 선정 > 공지사항
  • 093 profile_image
    23.♡.103.31 [公告]海外专利技术注册-系统半导体模拟设计IP > 注意
  • 094 profile_image
    47.♡.54.230 TSMC to enter 2nm, A14 process generations on schedule > News
  • 095 profile_image
    52.♡.93.170 注册为Semisolution Co., Ltd.会员、KT Eco:N（Ecoon）合作伙伴信息共享平台 > 注意
  • 096 profile_image
    100.♡.149.244 TSMC may see revenue fall 10-15%, 7nm capacity utilization slip to 50% in 1Q23 > 消息
  • 097 profile_image
    34.♡.82.68 이미지 크게보기
  • 098 profile_image
    54.♡.178.107 [新闻报道] Semisolution Co., Ltd.获得韩国企业数据技术信用评估颁发的“优秀技术能力”证书 > 注意
  • 099 profile_image
    18.♡.201.119 [공지] 한국무역보험공사 Honors Club 회원사 선정 > 공지사항
  • 100 profile_image
    18.♡.91.101 [业务协议]半解决方案-Bonanza PE投资业务协议 > 注意
  • 101 profile_image
    3.♡.180.70 TSMC to raise quotes for 5nm, 3nm process manufacturing in 2025 > News
  • 102 profile_image
    44.♡.131.50 TSMC to soon announce 2nd fab project in Japan, say sources > News
  • 103 profile_image
    47.♡.38.186 ニュース 66 페이지
  • 104 profile_image
    23.♡.250.48 Disclosure data 1 페이지
  • 105 profile_image
    44.♡.170.184 Intel-UMC to boost Intel market share via advanced foundry services for UMC customer base > ニュース
  • 106 profile_image
    34.♡.212.24 Global semiconductor market to rebound with 13% growth in 2024, says WSTS > News
  • 107 profile_image
    34.♡.82.73 【证书公告】职业经理人证书获得 > 注意
  • 108 profile_image
    23.♡.137.202 Faraday to Exhibit Next-gen ASIC Solutions at DAC 2024 > News
  • 109 profile_image
    52.♡.77.169 UMC negotiates higher quotes for new contract with Samsung > ニュース
  • 110 profile_image
    52.♡.41.164 グローバルファウンドリ業界、人工知能（AI）ブームで2桁成長 > ニュース
  • 111 profile_image
    34.♡.156.153 OpenAI's Altman forges AI alliances with Samsung and SK Hynix in South Korea > News
  • 112 profile_image
    34.♡.248.30 TSMC boosted by Intel, AMD, and Nvidia on the AI PC wave > ニュース
  • 113 profile_image
    52.♡.155.215 News 9 페이지
  • 114 profile_image
    54.♡.106.236 Taiwan firms gearing up for ASIC chip boom > 새소식
  • 115 profile_image
    40.♡.167.35 美国各州投资企业奖励动向 > 参考室
  • 116 profile_image
    3.♡.2.217 News 5 페이지
  • 117 profile_image
    52.♡.5.24 お知らせ 1 페이지
  • 118 profile_image
    98.♡.66.172 [사내소식] 2024년 리더십 특별 세미나 진행 > 공지사항
  • 119 profile_image
    44.♡.207.36 [공지사항] 주식액면분할에 따른 병합기준일 공고 > 공지사항
  • 120 profile_image
    44.♡.105.234 SEMISOLUTION
  • 121 profile_image
    54.♡.126.132 SEMISOLUTION
  • 122 profile_image
    146.♡.163.197 Faraday宣布计划在Intel 18A技术上开发基于Arm的64核SoC > 消息

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