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  • 001 profile_image
    100.♡.44.58 Foundries see IC design houses scale back orders for 4Q22 > News
  • 002 profile_image
    54.♡.136.244 Foundries see IC design houses scale back orders for 4Q22 > 새소식
  • 003 profile_image
    44.♡.19.8 TSMC maintains high capacity utilization for 7nm process platform > ニュース
  • 004 profile_image
    52.♡.54.136 Samsung reportedly wins first 2nm order in the most advanced chip-making race > News
  • 005 profile_image
    52.♡.249.218 [공지] 해외특허기술등록의 건 – 시스템반도체 아날로그 설계 IP의 건 > 공지사항
  • 006 profile_image
    52.♡.222.214 Automotive IC market share to reach 10% by 2026 > 새소식
  • 007 profile_image
    3.♡.103.254 Taiwan wafer foundry industry, 3Q 2025 > 새소식
  • 008 profile_image
    23.♡.250.48 ファラデー、すべてのファウンドリ向けのFinFET技術向け設計実装サービスを発表 > ニュース
  • 009 profile_image
    52.♡.141.124 Automotive semiconductor demand continues to rise as vehicle electronics evolve > ニュース
  • 010 profile_image
    35.♡.38.202 Foundries remain aggressive in fab capacity expansions > News
  • 011 profile_image
    3.♡.98.99 [Korea Enterprise Data] Acquired the Certificate of Excellent Technology Capability. > Notice
  • 012 profile_image
    52.♡.93.170 OpenAI's trillion-dollar chip plan can end well if right move is made > 消息
  • 013 profile_image
    44.♡.2.97 TSMC lowers 2024 semiconductor, foundry outlook > News
  • 014 profile_image
    35.♡.86.200 [展示会参加] 第23回半導体産業大戦 SEDEX 2021 展示会参加の件 (2021.1027～29) > お知らせ
  • 015 profile_image
    52.♡.174.139 [Press article] Semisolution Co., Ltd. signs a business partnership agreement with Blumind, a leading Canadian AI semiconductor company > Notice
  • 016 profile_image
    40.♡.167.44 [보도기사] 대기업-중소기업 맞손…수입 의존했던 디스플레이 부속품 R&D로 국산화 개발 성공 > 공지사항
  • 017 profile_image
    98.♡.200.43 NAND flash shortage may occur in 2H24 > ニュース
  • 018 profile_image
    34.♡.124.21 消息 13 페이지
  • 019 profile_image
    40.♡.167.16 TSMC discloses plan for 2nd fab in Japan > News
  • 020 profile_image
    44.♡.89.189 2022년 국내외 경제 및 산업전망 > 자료실
  • 021 profile_image
    18.♡.127.11 【参展】参加第25届半导体展SEDEX 2023展会（2023.10.25~27） > 注意
  • 022 profile_image
    44.♡.232.55 [西江大学産学協力団] ICT研究センター支援事業共同研究協定締結 > お知らせ
  • 023 profile_image
    50.♡.79.213 TSMC, UMC to see 22/28nm chips capacity fully loaded till end-year > ニュース
  • 024 profile_image
    98.♡.214.73 [Investment Agreement] Bonanza-Shinhan GIB Innovation Semiconductor Investment Association Investment Agreement Ceremony Proceeding > Notice
  • 025 profile_image
    34.♡.111.15 [Investment Agreement] Bonanza-Shinhan GIB Innovation Semiconductor Investment Association Investment Agreement Ceremony Proceeding > Notice
  • 026 profile_image
    52.♡.144.188 TSMC to enter 2nm, A14 process generations on schedule > 消息
  • 027 profile_image
    18.♡.89.56 Faraday在 DAC 2024 上展示下一代 ASIC 解决方案 > 消息
  • 028 profile_image
    52.♡.29.57 ニュース 2 페이지
  • 029 profile_image
    40.♡.167.235 Samsung wafer foundry aims to overtake TSMC by 2030 > 消息
  • 030 profile_image
    34.♡.226.74 SEMISOLUTION
  • 031 profile_image
    54.♡.238.89 SEMISOLUTION
  • 032 profile_image
    52.♡.203.206 [人现场]Semi-Solution首席执行官Lee Jung-won“灵活系统半导体开发环境决定成败” > 消息
  • 033 profile_image
    52.♡.191.202 Samsung's ups and downs (4): The manufacturing capability of Samsung's foundry biz > 消息
  • 034 profile_image
    44.♡.105.234 TSMC to raise foundry prices by 5-10% across advanced nodes in 2026 > ニュース
  • 035 profile_image
    52.♡.144.142 [보도기사] 대기업-중소기업 맞손…수입 의존했던 디스플레이 부속품 R&D로 국산화 개발 성공 > 공지사항
  • 036 profile_image
    54.♡.106.236 IC design houses uncertain about demand in 2023 > 消息
  • 037 profile_image
    44.♡.180.179 2022년 정부지원사업 소개자료 > 자료실
  • 038 profile_image
    107.♡.25.33 TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises (2025-12-15) > ニュース
  • 039 profile_image
    50.♡.193.48 TSMC reiterates 30% growth goal for 2022, citing surging demand from auto, HPC sectors > 消息
  • 040 profile_image
    98.♡.131.195 [お知らせ]韓国貿易保険公社Honors Club会員会社に選定 > お知らせ
  • 041 profile_image
    52.♡.113.104 TSMC to move 3nm process to commercial production in 4Q22 > 消息
  • 042 profile_image
    54.♡.240.58 [공지] 제20기 정기주주총회 소집통지의 건 > 공지사항
  • 043 profile_image
    184.♡.35.182 Specialty IC foundry VIS considering 12-inch fab > News
  • 044 profile_image
    52.♡.144.215 [공지사항] 공동 R&D 우수기업 현장 방문 행사 진행의 건 > 공지사항
  • 045 profile_image
    34.♡.132.215 ファラデー、サムスンファウンドリ14LPPプロセスにSAFE™IPポートフォリオを提供 > ニュース
  • 046 profile_image
    3.♡.80.71 [사내소식] 2024년 리더십 특별 세미나 진행 > 공지사항
  • 047 profile_image
    3.♡.85.234 TSMC to raise quotes for 5nm, 3nm process manufacturing in 2025 > ニュース
  • 048 profile_image
    3.♡.156.96 サムスン、TSMCに勝負数… 「GAA適用した3ナノチップ、来年上半期量産」 > ニュース
  • 049 profile_image
    52.♡.253.129 Global semiconductor market to rebound with 13% growth in 2024, says WSTS > ニュース
  • 050 profile_image
    34.♡.82.72 공지사항 5 페이지
  • 051 profile_image
    54.♡.98.148 CES 2024: Sony, Panasonic, and Sharp introduce cutting-edge AI applications in autos, homes > News
  • 052 profile_image
    57.♡.14.53 [공지] 공동투자형 구매조건부 신제품 개발 사업 “우수” 과제로 평가 완료 > 공지사항
  • 053 profile_image
    47.♡.97.121 전체검색 결과
  • 054 profile_image
    47.♡.115.155 TSMC to raise foundry prices by 5-10% across advanced nodes in 2026 > ニュース
  • 055 profile_image
    44.♡.69.106 [공지사항] 주식액면분할에 따른 병합기준일 공고 > 공지사항
  • 056 profile_image
    23.♡.137.202 Foundry houses may see orders, capacity utilization rebound in 2H23 > ニュース
  • 057 profile_image
    44.♡.106.171 [보도기사] 세미솔루션, 시스템반도체 핵심설계기술 미국특허권 획득 > 공지사항
  • 058 profile_image
    23.♡.179.27 [사내소식] 2023년 법정의무교육 실시 > 공지사항
  • 059 profile_image
    52.♡.6.26 Taiwan foundries see surge in orders transferred from China > ニュース
  • 060 profile_image
    40.♡.167.241 [공지사항] 제21기 정기주주총회 소집통지의 건 > 공지사항
  • 061 profile_image
    54.♡.158.162 [보도기사] 세미솔루션, '반도체대전(SEDEX 2023)'서 주문형시스템반도체 기술 · 솔루션 공개 > 공지사항
  • 062 profile_image
    44.♡.193.255 （株）セミソリューション、KT Eco：N（エコオン）パートナー社情報共有プラットフォーム会員社登録 > お知らせ
  • 063 profile_image
    52.♡.148.203 (주)세미솔루션, 2021 GMS (GBC 해외마케팅) 지원사업 선정 > 공지사항
  • 064 profile_image
    3.♡.174.110 [보도기사] 세미솔루션, '반도체대전(SEDEX 2023)'서 주문형시스템반도체 기술 · 솔루션 공개 > 공지사항
  • 065 profile_image
    3.♡.70.171 TSMC, Samsung face difficulty in ramping up 3nm chip production > 새소식
  • 066 profile_image
    52.♡.144.21 [공지사항] 제22기 정기주주총회 소집통지의 건 > 공지사항
  • 067 profile_image
    52.♡.102.51 [通知]李正元代表荣获产业技术安全表彰——产业通商资源部长官表彰 > 注意
  • 068 profile_image
    54.♡.147.79 국내 파운드리 3사, MPW 대폭 확대...팹리스 키운다 > 새소식
  • 069 profile_image
    52.♡.144.192 2025년도 구매연계·상생협력R&D사업 유공자 포상 선정 > 새소식
  • 070 profile_image
    3.♡.148.166 Global semiconductor market to rebound with 13% growth in 2024, says WSTS > News
  • 071 profile_image
    100.♡.133.214 TSMC to see all fab capacity utilization improve in 1Q24 > 消息
  • 072 profile_image
    52.♡.242.243 TSMC discloses plan for 2nd fab in Japan > 새소식
  • 073 profile_image
    54.♡.59.155 【内部动态】2023年将实施法定强制培训 > 注意
  • 074 profile_image
    44.♡.115.232 [인증공지] 소부장전문기업인증서 취득 > 공지사항
  • 075 profile_image
    3.♡.106.93 TSMC's 4Q25 revenue surges 20.5% on advanced process demand (2026-01-15) > News
  • 076 profile_image
    107.♡.224.184 Automotive semiconductor demand continues to rise as vehicle electronics evolve > 새소식
  • 077 profile_image
    52.♡.112.144 Taiwan wafer foundry industry, 3Q 2025 > News
  • 078 profile_image
    3.♡.59.93 TSMC sees 5/4nm capacity utilization pick up > ニュース
  • 079 profile_image
    3.♡.86.97 [공지사항] 공동 R&D 우수기업 현장 방문 행사 진행의 건 > 공지사항
  • 080 profile_image
    34.♡.24.180 TSMC turns active in seeking more long-term contracts > ニュース
  • 081 profile_image
    18.♡.251.19 ファラデー、UMCの22ULPおよび14FFCのDDR/LPDDRコンボPHY IPソリューションの提供を開始 > ニュース
  • 082 profile_image
    52.♡.209.13 글로벌 파운드리 업계, 인공지능(AI) 붐으로 두 자릿수 성장세 > 새소식
  • 083 profile_image
    34.♡.197.197 [공지] 제20기 정기주주총회 소집통지의 건 > 공지사항
  • 084 profile_image
    57.♡.14.91 [보도기사] 세미솔루션, '반도체대전(SEDEX 2023)'서 주문형시스템반도체 기술 · 솔루션 공개 > 공지사항
  • 085 profile_image
    54.♡.126.86 消息 1 페이지
  • 086 profile_image
    44.♡.172.204 Faraday宣布计划在Intel 18A技术上开发基于Arm的64核SoC > 消息
  • 087 profile_image
    216.♡.66.242 MediaTek intros flagship 4nm smartphone SoC > 새소식
  • 088 profile_image
    57.♡.14.80 [공지사항] 기업은행 'IBK강소기업' 선정 > 공지사항
  • 089 profile_image
    157.♡.39.10 Taiwan wafer foundry industry, 4Q 2025 > 消息
  • 090 profile_image
    40.♡.167.41 SMIC warns of 2026 memory squeeze: AI demand surges, customers turn cautious > 消息
  • 091 profile_image
    40.♡.167.32 [보도기사]세미솔루션, ‘2025년도 구매연계·상생협력R&D사업 유공자 포상’ 수상 > 공지사항
  • 092 profile_image
    207.♡.13.86 [公司新闻] Semi-solution Co., Ltd. 捐赠（非营利财团韩国矮子残疾人协会赞助） > 注意
  • 093 profile_image
    185.♡.107.88 [보도기사] ㈜세미솔루션, 한국기업데이터 기술신용평가 ‘기술역량 우수기업’ 인증서 획득 > 공지사항
  • 094 profile_image
    17.♡.219.148 SMIC warns of 2026 memory squeeze: AI demand surges, customers turn cautious > News
  • 095 profile_image
    3.♡.20.98 News 1 페이지
  • 096 profile_image
    206.♡.30.62 [Press article] Semisolution Co., Ltd. expands application-specific semiconductor (ASIC) development services to the automotive semiconductor field > Notice
  • 097 profile_image
    52.♡.144.201 [新闻文章] Semisolution获得系统半导体核心设计技术美国专利 > 注意
  • 098 profile_image
    34.♡.82.65 [보도기사] 세미솔루션, '반도체대전(SEDEX 2023)'서 주문형시스템반도체 기술 · 솔루션 공개 > 공지사항
  • 099 profile_image
    111.♡.244.250 전체검색 결과
  • 100 profile_image
    47.♡.15.159 [報道記事](株)セミソリューション、自動車半導体分野でカスタム半導体(ASIC)開発サービス拡大 > お知らせ
  • 101 profile_image
    34.♡.82.74 Preparing For 5G Millimeter Wave And 6G > 消息

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