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  • 001 profile_image
    40.♡.167.45 [공지사항] 임시주주총회 소집통지의 건 > 공지사항
  • 002 profile_image
    34.♡.82.65 SEMISOLUTION
  • 003 profile_image
    34.♡.82.71 Automotive IC market share to reach 10% by 2026 > 消息
  • 004 profile_image
    216.♡.66.242 Automotive IC market share to reach 10% by 2026 > News
  • 005 profile_image
    146.♡.185.193 OpenAI's trillion-dollar chip plan can end well if right move is made > News
  • 006 profile_image
    34.♡.82.68 OpenAI's trillion-dollar chip plan can end well if right move is made > 새소식
  • 007 profile_image
    40.♡.167.27 Semisolution Co., Ltd.入选2021年GMS（GBC海外营销）支援项目 > 注意
  • 008 profile_image
    47.♡.49.12 오류안내 페이지
  • 009 profile_image
    34.♡.82.66 TSMC turns active in seeking more long-term contracts > 새소식
  • 010 profile_image
    34.♡.82.72 TSMC sees 5/4nm capacity utilization pick up > ニュース
  • 011 profile_image
    17.♡.227.129 [특허등록] 특허기술등록의 건 - 시스템반도체 아날로그설계 IP의 건 > 공지사항
  • 012 profile_image
    43.♡.139.6 오류안내 페이지
  • 013 profile_image
    47.♡.116.210 오류안내 페이지
  • 014 profile_image
    47.♡.63.140 패러데이, UMC 22ULP 및 14FFC 기반 DDR/LPDDR 콤보 PHY IP 솔루션 출시 > 새소식
  • 015 profile_image
    34.♡.82.78 글로벌 파운드리 업계, 인공지능(AI) 붐으로 두 자릿수 성장세 > 새소식
  • 016 profile_image
    216.♡.216.179 SEMISOLUTION
  • 017 profile_image
    47.♡.26.245 [포럼행사] 공공인프라 시스템 반도체 활성화 방안 포럼 초청 > 공지사항
  • 018 profile_image
    52.♡.63.151 Faraday unveils enhanced Gigabit Ethernet PHY for UMC's 28HPC+ process > News
  • 019 profile_image
    34.♡.82.74 SEMISOLUTION
  • 020 profile_image
    35.♡.86.200 [포럼행사] 공공인프라 시스템 반도체 활성화 방안 포럼 초청 > 공지사항
  • 021 profile_image
    54.♡.169.168 TSMC cuts capex outlook after record 3Q22 profit > 消息
  • 022 profile_image
    107.♡.181.148 Automotive IC market share to reach 10% by 2026 > ニュース
  • 023 profile_image
    146.♡.174.203 [업무협약] 세미솔루션 - 보난자PE 투자업무 협약 > 공지사항
  • 024 profile_image
    52.♡.237.170 TSMC turns active in seeking more long-term contracts > 消息
  • 025 profile_image
    100.♡.153.9 Three domestic foundries significantly expand MPW... grow fabless > 消息
  • 026 profile_image
    34.♡.60.66 Foundry customers reluctant to accept further price increases > 消息
  • 027 profile_image
    3.♡.222.168 Automotive semiconductor demand continues to rise as vehicle electronics evolve > 消息
  • 028 profile_image
    3.♡.86.97 [新闻报道]Semisolution被评选为购买条件合作业务优秀成功案例企业 > 注意
  • 029 profile_image
    34.♡.197.175 Automotive IC supply remains tight > 消息
  • 030 profile_image
    54.♡.169.196 [공지사항] 제22기 정기주주총회 소집통지의 건 > 공지사항
  • 031 profile_image
    50.♡.79.213 ファラデーFPGA-Go-ASIC™、市場進出に成功 > ニュース
  • 032 profile_image
    34.♡.163.103 Intel-UMC to boost Intel market share via advanced foundry services for UMC customer base > 消息
  • 033 profile_image
    52.♡.29.57 Foundries remain aggressive in fab capacity expansions > ニュース
  • 034 profile_image
    18.♡.39.188 UMC plans another price hike, sources say > 새소식
  • 035 profile_image
    3.♡.157.25 TSMC to raise quotes for 5nm, 3nm process manufacturing in 2025 > 새소식
  • 036 profile_image
    34.♡.243.131 Testing houses to see strong 1Q22 > News
  • 037 profile_image
    34.♡.237.236 Samsung, TSMC to win... “3-nano chips with GAA applied, mass-produced in the first half of next year” > 消息
  • 038 profile_image
    34.♡.138.57 전자증권 전환대상 주권 등의 권리자 보호 안내 > 공지사항
  • 039 profile_image
    34.♡.82.75 [공지사항] 2024년 2차 윈윈아너스 기념패 수여의 건 > 공지사항
  • 040 profile_image
    40.♡.167.17 [Patent registration] Patent technology registration - system semiconductor analog design IP > Notice
  • 041 profile_image
    34.♡.212.24 Specialty IC foundry VIS considering 12-inch fab > News
  • 042 profile_image
    50.♡.248.61 TSMC discloses plan for 2nd fab in Japan > 새소식
  • 043 profile_image
    3.♡.148.166 [공지사항] 2024년 2차 윈윈아너스 기념패 수여의 건 > 공지사항
  • 044 profile_image
    50.♡.193.48 TSMC plans A14 process manufacturing in Kaohsiung, say sources > 消息
  • 045 profile_image
    54.♡.238.89 UMC sees no signs of substantial demand recovery in 2H23 > ニュース
  • 046 profile_image
    34.♡.114.170 Automotive semiconductor demand continues to rise as vehicle electronics evolve > News
  • 047 profile_image
    54.♡.152.179 [Contributed] Policy proposals for the development of the system semiconductor industry > News
  • 048 profile_image
    18.♡.89.56 Why Wafer Bumps Are Suddenly So Important > 消息
  • 049 profile_image
    34.♡.206.30 Automotive IC market share to reach 10% by 2026 > 새소식
  • 050 profile_image
    34.♡.118.144 TSMC to expand 7nm and 28nm fab capacities > ニュース
  • 051 profile_image
    40.♡.167.72 TSMC to raise quotes for 5nm, 3nm process manufacturing in 2025 > ニュース
  • 052 profile_image
    23.♡.175.228 Faraday Announces Multi-site Manufacturing Support in ASIC > 새소식
  • 053 profile_image
    40.♡.167.126 [공지사항] 기업은행 'IBK강소기업' 선정 > 공지사항
  • 054 profile_image
    184.♡.95.195 (주)세미솔루션, 2021 GMS (GBC 해외마케팅) 지원사업 선정 > 공지사항
  • 055 profile_image
    34.♡.197.197 Testing houses to see strong 1Q22 > ニュース
  • 056 profile_image
    34.♡.82.64 OpenAI's trillion-dollar chip plan can end well if right move is made > 새소식
  • 057 profile_image
    52.♡.26.180 Specialty IC foundry VIS considering 12-inch fab > ニュース
  • 058 profile_image
    34.♡.252.22 Foundry capacity to stay tight in 2022 as global IC shortage lingers > 消息
  • 059 profile_image
    34.♡.114.237 Samsung's ups and downs (4): The manufacturing capability of Samsung's foundry biz > ニュース
  • 060 profile_image
    146.♡.184.208 【通知】KAIST GCC（全球技术商业化中心）全球市场进入计划支持项目评选 > 注意
  • 061 profile_image
    3.♡.98.99 [공지사항] 제22기 정기주주총회 소집통지의 건 > 공지사항
  • 062 profile_image
    52.♡.144.222 [전시회참가] 제25회 반도체대전 SEDEX 2023 전시회 참가의 건 (2023.10.25~27) > 공지사항
  • 063 profile_image
    47.♡.122.183 SEMISOLUTION
  • 064 profile_image
    52.♡.144.211 [공지사항] 기업은행 'IBK강소기업' 선정 > 공지사항

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