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  • 001 profile_image
    52.♡.144.21 고객문의 1 페이지
  • 002 profile_image
    34.♡.85.139 2022년 정부지원사업 소개자료 > 자료실
  • 003 profile_image
    52.♡.152.231 오류안내 페이지
  • 004 profile_image
    3.♡.221.125 UMC reportedly mulling 6% quote hikes for 22/28nm chips in 2023 > 새소식
  • 005 profile_image
    44.♡.232.231 [お知らせ]韓国貿易保険公社Honors Club会員会社に選定 > お知らせ
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    34.♡.197.127 [사내소식] 2024년 리더십 특별 세미나 진행 > 공지사항
  • 007 profile_image
    34.♡.89.140 [通知]关于召开第二十次股东大会的通知 > 注意
  • 008 profile_image
    52.♡.93.170 Testing houses to see strong 1Q22 > News
  • 009 profile_image
    52.♡.144.238 [공지사항] 공동 R&D 우수기업 현장 방문 행사 진행의 건 > 공지사항
  • 010 profile_image
    43.♡.46.118 SEMISOLUTION
  • 011 profile_image
    34.♡.95.99 Why Wafer Bumps Are Suddenly So Important > News
  • 012 profile_image
    54.♡.163.42 8-inch fabs to enjoy robust business growth through 2026, says VIS chair > ニュース
  • 013 profile_image
    52.♡.52.82 Samsung foundry business overview > News
  • 014 profile_image
    40.♡.167.70 [인증공지] 소부장전문기업인증서 취득 > 공지사항
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    52.♡.144.187 [보도기사] 세미솔루션, 시스템반도체 핵심설계기술 미국특허권 획득 > 공지사항
  • 016 profile_image
    54.♡.126.86 SMIC expects over 10% revenue drop in 4Q22 > 새소식
  • 017 profile_image
    47.♡.54.7 [사내소식] (주)세미솔루션 기부 동참(후원처: 사단법인 써빙프렌즈인터내셔널) > 공지사항
  • 018 profile_image
    52.♡.5.24 패러데이 FPGA-Go-ASIC™, 시장 진출에 성공 > 새소식
  • 019 profile_image
    34.♡.67.98 Taiwan foundries see surge in orders transferred from China > 새소식
  • 020 profile_image
    34.♡.82.72 오류안내 페이지
  • 021 profile_image
    18.♡.79.144 TSMC discloses plan for 2nd fab in Japan > 消息
  • 022 profile_image
    184.♡.84.154 [展示会参加] 第25回半導体大戦 SEDEX 2023 展示会参加の件 (2023.10.25～27) > お知らせ
  • 023 profile_image
    35.♡.205.140 [공지] 이정원 대표이사 산업기술보안 유공자 표창 수여 – 산업통상자원부 장관 표창 > 공지사항
  • 024 profile_image
    54.♡.82.195 SMIC warns of 2026 memory squeeze: AI demand surges, customers turn cautious > News
  • 025 profile_image
    52.♡.81.148 Samsung wafer foundry aims to overtake TSMC by 2030 > News
  • 026 profile_image
    52.♡.253.129 Foundry capacity expansion projects may face delays > 새소식
  • 027 profile_image
    54.♡.161.62 [공지사항] 제21기 정기주주총회 소집통지의 건 > 공지사항
  • 028 profile_image
    34.♡.233.48 Specialty IC foundry VIS considering 12-inch fab > 消息
  • 029 profile_image
    34.♡.24.180 Faraday Announces Multi-site Manufacturing Support in ASIC > News
  • 030 profile_image
    3.♡.114.189 Foundries may lower prices for mature processes in 2Q24 > News
  • 031 profile_image
    47.♡.61.24 TSMC lowers 2024 semiconductor, foundry outlook > ニュース
  • 032 profile_image
    35.♡.141.42 ファラデーFPGA-Go-ASIC™、市場進出に成功 > ニュース
  • 033 profile_image
    40.♡.167.131 SEMISOLUTION
  • 034 profile_image
    54.♡.84.74 Pure-play foundries poised to enjoy profit growth in 2022 > ニュース
  • 035 profile_image
    3.♡.215.92 TSMC to raise quotes for 5nm, 3nm process manufacturing in 2025 > ニュース
  • 036 profile_image
    34.♡.156.0 [사내소식] 2024년 리더십 특별 세미나 진행 > 공지사항
  • 037 profile_image
    34.♡.41.241 TSMC, UMC to see 22/28nm chips capacity fully loaded till end-year > News
  • 038 profile_image
    52.♡.218.25 TSMC sees 5/4nm capacity utilization pick up > ニュース
  • 039 profile_image
    204.♡.116.166 Taiwan foundries may freeze quotes in 2Q22 > ニュース
  • 040 profile_image
    54.♡.199.17 Faraday Announces Multi-site Manufacturing Support in ASIC > News
  • 041 profile_image
    40.♡.167.61 [공지사항] 주식액면분할에 따른 병합기준일 공고 > 공지사항
  • 042 profile_image
    34.♡.197.175 Faraday FPGA-Go-ASIC™ 上市 > 消息
  • 043 profile_image
    54.♡.102.81 OpenAI's Altman forges AI alliances with Samsung and SK Hynix in South Korea > 消息
  • 044 profile_image
    3.♡.29.96 TSMC sees 5/4nm capacity utilization pick up > News
  • 045 profile_image
    98.♡.38.120 Preparing For 5G Millimeter Wave And 6G > News
  • 046 profile_image
    54.♡.109.140 披露数据 1 페이지
  • 047 profile_image
    44.♡.37.41 TSMC to move 3nm process to commercial production in 4Q22 > 새소식
  • 048 profile_image
    47.♡.34.228 TSMC plans price hike for 8-inch foundry services > News
  • 049 profile_image
    34.♡.82.64 TSMC on track to move 2nm process to risk production in 4Q24 > 消息
  • 050 profile_image
    34.♡.249.188 [공지사항] 임시주주총회 소집통지의 건 > 공지사항
  • 051 profile_image
    52.♡.58.41 TSMC sees 5/4nm capacity utilization pick up > 消息
  • 052 profile_image
    52.♡.105.244 Global wafer foundry industry, 2026 and beyond > ニュース
  • 053 profile_image
    52.♡.242.243 TSMC on track to move 2nm process to risk production in 4Q24 > ニュース
  • 054 profile_image
    100.♡.160.53 TSMC plans price hike for 8-inch foundry services > 새소식
  • 055 profile_image
    3.♡.199.128 [報道記事]セミソリューション、購買条件部協力事業優秀成功事例企業選定 > お知らせ
  • 056 profile_image
    184.♡.68.20 IC design houses uncertain about demand in 2023 > 새소식
  • 057 profile_image
    18.♡.27.222 ファラデー、サムスンファウンドリ14LPPプロセスにSAFE™IPポートフォリオを提供 > ニュース
  • 058 profile_image
    44.♡.2.97 Global wafer foundry industry, 2026 and beyond > News
  • 059 profile_image
    44.♡.120.22 [사내소식] (주)세미솔루션 기부 동참(후원처: 사단법인 써빙프렌즈인터내셔널) > 공지사항
  • 060 profile_image
    47.♡.59.251 Why Wafer Bumps Are Suddenly So Important > 새소식
  • 061 profile_image
    18.♡.36.1 [報道記事](株)セミソリューション、カナダ代表AI半導体企業Blumind社と事業提携契約締結 > お知らせ
  • 062 profile_image
    23.♡.214.190 SEDEX 2025 세미솔루션 부스 안내의 건입니다. > 새소식
  • 063 profile_image
    54.♡.93.8 투명LED Display用 구동 IC 관련 문의의 件 > 고객문의
  • 064 profile_image
    3.♡.156.96 [Notice] KAIST GCC (Global Technology Commercialization Center) Global Market Entry Program Support Project Selection > Notice
  • 065 profile_image
    34.♡.118.144 [한국기업데이타] 기술역량우수기업인증서를 취득하였습니다. > 공지사항
  • 066 profile_image
    34.♡.9.144 Foundries remain aggressive in fab capacity expansions > ニュース
  • 067 profile_image
    18.♡.91.101 TSMC may see revenue fall 10-15%, 7nm capacity utilization slip to 50% in 1Q23 > 새소식
  • 068 profile_image
    98.♡.184.80 Automotive IC market share to reach 10% by 2026 > ニュース
  • 069 profile_image
    54.♡.63.52 Taiwan foundries see surge in orders transferred from China > 새소식
  • 070 profile_image
    98.♡.59.253 TSMC, Samsung face difficulty in ramping up 3nm chip production > 새소식
  • 071 profile_image
    47.♡.119.46 [공지] 해외특허기술등록의 건 – 시스템반도체 아날로그 설계 IP의 건 > 공지사항
  • 072 profile_image
    23.♡.119.232 (주)세미솔루션 홈페이지 리뉴얼 공지의 건 > 공지사항
  • 073 profile_image
    3.♡.69.161 TSMC, UMC to see 22/28nm chips capacity fully loaded till end-year > ニュース
  • 074 profile_image
    34.♡.138.57 NAND flash shortage may occur in 2H24 > News
  • 075 profile_image
    47.♡.193.79 [공지사항] 임시주주총회 소집통지의 건 > 공지사항
  • 076 profile_image
    44.♡.19.8 [Notice] Notice of convocation of the 20th regular general meeting of shareholders > Notice
  • 077 profile_image
    98.♡.200.43 [서강대 산학협력단] ICT연구센터 지원사업 공동연구 협약체결 > 공지사항
  • 078 profile_image
    23.♡.227.240 注册为Semisolution Co., Ltd.会员、KT Eco:N（Ecoon）合作伙伴信息共享平台 > 注意
  • 079 profile_image
    34.♡.206.30 Global wafer foundry industry, 2026 and beyond > News
  • 080 profile_image
    54.♡.84.219 ㈱セミソリューションのホームページリニューアルお知らせの件 > お知らせ
  • 081 profile_image
    3.♡.102.111 ニュース 6 페이지
  • 082 profile_image
    45.♡.24.139 비밀번호 입력
  • 083 profile_image
    47.♡.118.34 UMC to raise quotes for 28nm processes again > 새소식
  • 084 profile_image
    54.♡.248.117 消息 9 페이지
  • 085 profile_image
    34.♡.164.233 [보도기사] 대기업-중소기업 맞손…수입 의존했던 디스플레이 부속품 R&D로 국산화 개발 성공 > 공지사항
  • 086 profile_image
    54.♡.181.161 공지사항 3 페이지
  • 087 profile_image
    35.♡.240.53 SEMISOLUTION
  • 088 profile_image
    54.♡.152.179 News 8 페이지
  • 089 profile_image
    54.♡.69.192 [報道記事]セミソリューション、システム半導体コア設計技術米国特許権を獲得 > お知らせ
  • 090 profile_image
    35.♡.238.50 注意 1 페이지
  • 091 profile_image
    100.♡.204.82 News 8 페이지
  • 092 profile_image
    50.♡.72.185 News 1 페이지
  • 093 profile_image
    52.♡.127.170 SEDEX 2025 세미솔루션 부스 안내의 건입니다. > 새소식
  • 094 profile_image
    47.♡.124.163 UMC negotiates higher quotes for new contract with Samsung > 새소식
  • 095 profile_image
    184.♡.167.217 [보도기사] 세미솔루션, 구매조건부 협력사업 우수성공사례기업 선정 > 공지사항
  • 096 profile_image
    44.♡.76.210 SEMISOLUTION
  • 097 profile_image
    44.♡.232.55 RFQ 1 페이지
  • 098 profile_image
    3.♡.190.107 UMC may resume 14/12nm nodes for new-gen car, networking chips > 消息
  • 099 profile_image
    23.♡.250.48 Foundries remain aggressive in fab capacity expansions > News
  • 100 profile_image
    34.♡.45.47 Foundry fabs may see automotive clients cut back on orders > 새소식
  • 101 profile_image
    179.♡.138.8 SEMISOLUTION
  • 102 profile_image
    34.♡.234.246 Intel's EMIB becomes potential alternative to TSMC's CoWoS > ニュース
  • 103 profile_image
    54.♡.18.27 TSMC boosted by Intel, AMD, and Nvidia on the AI PC wave > News
  • 104 profile_image
    47.♡.114.248 TSMC to fab Nvidia next-gen AI chip, sources say > News
  • 105 profile_image
    78.♡.53.160 [Notice] KAIST GCC (Global Technology Commercialization Center) Global Market Entry Program Support Project Selection > Notice
  • 106 profile_image
    54.♡.90.224 기준일 및 주주명부 폐쇄기간 설정 공고 > 공지사항
  • 107 profile_image
    44.♡.193.255 [보도기사] 세미솔루션, 시스템반도체 핵심설계기술 미국특허권 획득 > 공지사항
  • 108 profile_image
    3.♡.205.90 [사내소식] 2023년 법정의무교육 실시 > 공지사항
  • 109 profile_image
    52.♡.89.12 [사내소식] 2024년 리더십 특별 세미나 진행 > 공지사항
  • 110 profile_image
    198.♡.105.213 ファラデー、UMCの28HPC+プロセスで強化されたギガビットイーサネットPHYを公開 > ニュース
  • 111 profile_image
    52.♡.144.23 [사내소식] 2023년 법정의무교육 실시 > 공지사항
  • 112 profile_image
    220.♡.51.116 RFQ 1 페이지
  • 113 profile_image
    44.♡.131.50 Taiwan wafer foundry industry, 1Q 2025 > 새소식
  • 114 profile_image
    116.♡.32.155 SEMISOLUTION
  • 115 profile_image
    100.♡.155.89 TSMC boosted by Intel, AMD, and Nvidia on the AI PC wave > 消息
  • 116 profile_image
    116.♡.32.145 [보도기사] 세미솔루션, 시스템반도체 핵심설계기술 미국특허권 획득 > 공지사항
  • 117 profile_image
    116.♡.32.177 공지사항 1 페이지
  • 118 profile_image
    98.♡.63.147 NAND flash shortage may occur in 2H24 > News
  • 119 profile_image
    54.♡.191.179 UMC to raise quotes for 28nm processes again > 새소식
  • 120 profile_image
    18.♡.186.220 [報道記事]セミソリューション、システム半導体コア設計技術米国特許権を獲得 > お知らせ
  • 121 profile_image
    192.♡.121.7 TSMC on track to move 2nm process to risk production in 4Q24 > ニュース
  • 122 profile_image
    35.♡.125.172 TSMC on track to move 2nm process to risk production in 4Q24 > 새소식
  • 123 profile_image
    47.♡.28.120 Foundry capacity expansion projects may face delays > 새소식
  • 124 profile_image
    23.♡.175.228 [보도기사]세미솔루션, ‘2025년도 구매연계·상생협력R&D사업 유공자 포상’ 수상 > 공지사항
  • 125 profile_image
    23.♡.99.55 TSMC to see all fab capacity utilization improve in 1Q24 > 새소식
  • 126 profile_image
    3.♡.46.222 UMC reportedly mulling 6% quote hikes for 22/28nm chips in 2023 > 消息
  • 127 profile_image
    52.♡.37.237 OpenAI's Altman forges AI alliances with Samsung and SK Hynix in South Korea > 새소식
  • 128 profile_image
    18.♡.12.157 TSMC reiterates 30% growth goal for 2022, citing surging demand from auto, HPC sectors > ニュース
  • 129 profile_image
    40.♡.167.235 [특허등록] 특허기술등록의 건 - 시스템반도체 아날로그설계 IP의 건 > 공지사항
  • 130 profile_image
    3.♡.148.166 Taiwan wafer foundry industry, 1Q 2025 > 새소식
  • 131 profile_image
    18.♡.240.226 Faraday, Intel 18A 기술을 기반으로 Arm 기반 64코어 SoC 개발 계획 발표 > 새소식
  • 132 profile_image
    184.♡.195.18 Taiwan foundries see surge in orders transferred from China > 새소식
  • 133 profile_image
    50.♡.216.166 TSMC overseas foundry quotes to be 10-30% higher than in Taiwan > ニュース
  • 134 profile_image
    47.♡.99.113 Automotive semiconductor demand continues to rise as vehicle electronics evolve > 새소식
  • 135 profile_image
    40.♡.167.75 [보도기사]세미솔루션, ‘2025년도 구매연계·상생협력R&D사업 유공자 포상’ 수상 > 공지사항
  • 136 profile_image
    52.♡.144.195 [공지사항] 2024년 2차 윈윈아너스 기념패 수여의 건 > 공지사항
  • 137 profile_image
    45.♡.149.65 (주)세미솔루션, 2021 GMS (GBC 해외마케팅) 지원사업 선정 > 공지사항
  • 138 profile_image
    47.♡.123.115 SEDEX 2025 세미솔루션 부스 안내의 건입니다. > 새소식
  • 139 profile_image
    40.♡.167.154 [Sogang University Industry-University Cooperation Foundation] ICT Research Center Support Project Joint Research Agreement Signed > Notice
  • 140 profile_image
    17.♡.23.191 Global semiconductor market to rebound with 13% growth in 2024, says WSTS > 새소식
  • 141 profile_image
    170.♡.160.90 고객문의 글쓰기
  • 142 profile_image
    47.♡.124.42 Taiwan top-3 foundries to see combined revenues surge over 20% in 2021 > 새소식

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